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IPC 9850 : 0

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SURFACE MOUNT PLACEMENT EQUIPMENT CHARACTERIZATION
Available format(s)

Hardcopy

Superseded date

07-23-2013

Language(s)

English

1 INTRODUCTION
2 REFERENCED DOCUMENTS
3 PLACEMENT PERFORMANCE METRIC
4 LINE SUMMARY FORM IPC-9850-F
5 MEASUREMENT SYSTEM ANALYSIS (MSA) CAPABILITY-FORM
  IPC-9850-F3
6 TEST VEHICLES
7 FORMS AND DIAGRAMS
Appendix A - Capability Indexes
Appendix B - Specification Limits for Cpk Values
Appendix C - Guidelines for Adhesive Used for Machine
             Capability Testing (Selection and Application)
Appendix D - Suggested Methodologies for Measuring
             Components Using an Optical CMM
Appendix E - Component Centroid Locations for Panel
             Population (relative to the lower left
             fiducial)
Appendix F - Component Location for CMM Verification
             Panel
Appendix G - How to Perform a GR&R Test Instruction
             for Using the Gauge R&R Spreadsheet
Appendix H - Reliability and Utilization Definitions
Appendix I - Placement Verification Panel Carrier
Appendix J - Instruction for Using The IPC-9850-MLTE.xls
             Spreadsheets

Sets up the procedures to characterize the capability of surface mount assembly equipment in specification documents, as well as in documentation used to verify a specific machine's placement capability and conformance to the specification while maintaining placement accuracy to placement throughput relationship.

DevelopmentNote
Includes one printed copy of the standard and a CD with support documentation. (12/2011) Also available in CD-ROM format. (07/2013)
DocumentType
Standard
Pages
0
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

IPC 9262 : 2016 SPECIFICATION FOR CHARACTERIZATION AND VERIFICATION OF ASSEMBLY LEVEL AUTOMATIC OPTICAL INSPECTION EQUIPMENT

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS

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