1.0 Scope
1.1 Purpose
1.2 Classification
1.3 Presentation
1.4 Interpretation
1.5 Organization of Design Information
1.6 Order of Precedence
1.7 Terms and Definitions
2.0 Applicable Documents
2.1 Institute for Interconnecting and Packaging
      Electronic Circuits (IPC)
2.2 Department of Defense
2.3 Other Documents
3.0 Design Considerations
3.1 General
3.2 Design Layout
3.3 Design Features
3.4 Test Requirement Considerations
3.5 Electrical Requirement Considerations
3.6 Thermal Management Considerations
3.7 Mechanical Requirement Considerations
3.8 Materials
4.0 Component Mounting and Attachment
4.1 General Requirements
4.2 Leads Mounted in Through-Holes
4.3 Surface-Mounted Leaded Components
4.4 Surface Mount Leadless Components
4.5 Component Lead Sockets
4.6 Connectors and Interconnects
4.7 Solder Terminals, Eyelets, Fasteners, Stiffeners
      and Board Extractors
4.8 Special Wiring
5.0 Board Design Requirements
5.1 Layout Concepts
5.2 Board Geometries
5.3 Circuit Features
5.4 Holes
5.5 Coatings and Markings
6.0 Documentation & Phototooling
6.1 Layout
6.2 Master Drawing
6.3 Artwork
6.4 Production Master
6.5 Assembly Drawing
6.6 Final Schematic/Logic
6.7 Final Bill of Material
6.8 Government Deviation Requirements
7.0 Quality Assurance
7.1 Material Quality Assurance
7.2 Qualification Evaluations
7.3 Quality Conformance Evaluations
8.0 Appendix
8.1 Purpose
8.2 Material Selection
8.3 Laminate Properties
8.4 Prepreg
8.5 Material Specification
8.6 Material Designation
8.7 Commonly Used Symbology for Dimensioning and
      Tolerancing Printed Boards
8.8 Drill Sizes Recommendations for Printed Boards
9.0 Index
Numerous Figures
Numerous Tables