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IPC D 350 : 0

Current

Current

The latest, up-to-date edition.

PRINTED BOARD DESCRIPTION IN DIGITAL FORM

Available format(s)

Hardcopy

Language(s)

English

Published date

07-01-1992

Acknowledgements
Table of Contents
Committee Members
1.0 Scope
1.1 Format Compatibility
2.0 Applicable Documents
2.1 IPC
2.2 American National Standards Institute
2.3 Department of Defense
3. Terms and Definitions
3.1 Annotation
3.2 Comment Records
3.3 Complex or Composite Records
3.4 Data Information Module (DIM)
3.5 Data Layer
3.6 Feature Location Record
3.7 Job Set
3.8 Modal Form
3.9 Parameter Record
3.10 Physical Layer
3.11 Subroutine
3.12 Subroutine Call
4.0 General Requirements
4.1 Data Hierarchy
4.2 Basic Record Types
4.3 Data Set Descriptions
4.4 Data Orientation
4.5 Transfer Media and Data Formats
5.0 Parameter Records
5.1 Parameter JOB
5.2 Parameter - DIM (Data Information Module)
5.3 Parameter - Units
5.4 Parameter - TITLE
5.5 Parameter - NUM
5.6 Parameter - REV
5.7 Parameter - TOL
5.8 Parameter - SCALE
5.9 Parameter Layer
5.10 Parameter - IMAGE
5.11 Parameter - FAB
5.12 Parameter - LANG
6.0 Comment Records
7.0 Feature/Location Area Format
7.1 General Information
7.2 Operations Code Description area
7.3 Features Description Area (FDA)
7.4 Location Description Area (LDA)(Columns 31-72)
7.5 Unassigned Columns
8.0 Line Record Definition
8.1 Special Requirements for Line Records
8.2 Operations Code Definitions (Columns 1-3)
8.3 'D' Field Definition (Columns 4-8)
8.4 Data Layer Code Field (Columns 9-11)
8.5 Signal Identification Field (Columns 12-18)
8.6 'H' Field Definition (Columns 19-23)
8.7 'P' Field Definition (Columns 24-25)
8.8 'G' Field Definition (Columns 26-27)
8.9 LDA Field Definition (Columns 31-72)
9.0 Point Record Definition
9.1 Operation Code Definition (Columns 1-3)
9.2 'D' Field Definition (Columns 4-8)
9.3 Data Layer Code Field (Columns 9-11)
9.4 Signal Identification Field (Columns 12-18)
9.5 'H' Field Definition (Columns 19-23)
9.6 'P' Field Definition (Columns 24 and 25)
9.7 'G' Field Definition (Columns 26-27)
9.8 LDA Field Definition (Columns 31-72)
10.0 Annotation Record Definition
10.1 Annotation Record
10.2 'D' Field Definition (Columns 4-8)
10.3 Data Layer Code Field (Columns 9-11)
10.4 'S' Field Definition (Columns 12-18)
10.5 'H' Field Definition (Columns 19-23)
10.6 'P' Field Definition (Columns 24-25)
10.7 'G' Field Definition (Columns 26-27)
10.8 'LDA' Field Definition (Columns 31-72)
10.9 Continuation Records (Columns 4-72)
11.0 Subroutines
11.1 General
11.2 Subroutine Definition Operation Code 2
11.3 Subroutine CALL Records
Appendix

Specifies record formats describing printed board products providing sufficient detail on tooling, manufacturing and testing requirements. These formats may be used for transmitting information between the printed board designer and the manufacturing facility. The records are also useful when the manufacturing cycle includes computer aided processes and numerical control machines. The information can be used for both manual and for digital interpretation. Thus, each facility can produce a printed board product from the data by the most efficient method available. The data may be defined in either customary or metric units.

DevelopmentNote
This document is frozen; no future updates are planned. (03/2002) Also numbered as IEC 61182-1. (06/2002)
DocumentType
Standard
Pages
94
PublisherName
Institute of Printed Circuits
Status
Current

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