1 SCOPE AND OBJECTIVE
   1.1 Format Compatibility
   1.2 Goal of Revision B
   1.3 Changes Between Revision A and B
   1.4 Data Records and Their Organization
   1.5 IPC D-356B file Usage
   1.6 Interpretation
2 APPLICABLE DOCUMENTS
   2.1 IPC
   2.2 American National Standards Institute
   2.3 International Electrotechnical Commission (IEC)
        International Standards Organization (ISO)
3 TERMS AND DEFINITIONS
   3.1 Field
   3.2 Record
   3.3 Physical Layer
   3.4 Job Data
   3.5 Feature
   3.6 Datum Reference
   3.7 Modal Form
   3.8 Operation Codes
   3.9 End-Point Optimization
   3.10 Adjacency
4 GENERAL REQUIREMENTS
   4.1 Data Hierarchy
   4.2 Basic Record Types
   4.3 Compatibility
   4.4 Fixed and Field Delimited Formats
   4.5 Data Set Descriptions
   4.6 Data Sorting
   4.7 Data Orientation
   4.8 Line Termination
   4.9 Transfer Media and Data Formats
5 ORGANIZATION OF THE IPC-D-356B FILE
   5.1 Organization of the Job Data File
6 PARAMETER RECORDS AND JOB DATA FILE ORGANIZATION
   6.1 Parameter JOB
   6.2 Parameter CODE
   6.3 Parameter UNITS
   6.4 Parameter TITLE
   6.5 Parameter NUM
   6.6 Parameter REV
   6.7 Parameter VER
   6.8 Parameter IMAGE
   6.9 Parameter REMOVED_CONDUCTORS
   6.10 Parameter NNAME
   6.11 Parameter TEST
   6.12 Parameter SECONDARY_SIDE_LAYER
   6.13 Parameter GRID_UNITS
   6.14 Parameter SOURCE
   6.15 Parameter ADJACENCY
   6.16 Parameter BOARD_ THICKNESS
7 COMMENT RECORDS AND ALLOWED CHARACTERS
   7.1 Allowable Character Set
   7.2 Comment Records Utilizing 2-Byte
8 ELECTRICAL TEST RECORDS STRUCTURE
   8.1 Operation Code Definition (Columns 1-3)
   8.2 Signal Name Identifier (Columns 4-20)
   8.3 Component Name Identifier (Columns 21-31)
   8.4 Columns 33-38
   8.5 Feature Side and Layer Designation
        (Columns 39-41)
   8.6 Feature Location Field (Columns 42-57)
   8.7 Feature Shape and Size Definition
        (Columns 58 and beyond)
   8.8 Rotation of Standard Shapes
   8.9 Soldermask Defined Edges
   8.10 Test Area Attributes
   8.11 Complex Records
   8.12 Non-Conductive holes
9 SPECIFIED TEST POINT LOCATION
   9.1 Operation Code Definition (Columns 1-3)
   9.2 Signal Identification Field (Columns 4-17)
   9.3 Unassigned Fields (Columns 18-21)
   9.4 Assigned Tester Label Field (Columns 22-37)
   9.5 Unassigned Field (Column 38)
   9.6 Tester Side Designation (Columns 39-41)
   9.7 Test Point Location Field (columns 42-57)
   9.8 Z Access Information (Columns 59-66)
   9.9 Unassigned Field (Column 67)
   9.10 Optional Multi-Image Test Indicator
        (Columns 68-72)
   9.11 Unassigned Field (Column 73)
   9.12 Optional Multi-Test Indicator
        (Columns 74-75)
10 GRAPHICAL SUPPORT OF BOARD IMAGE
   10.1 Trace Segment Data
   10.2 Contour Copper (Polygon) Areas
   10.3 Board and Panel Outlines
11 ADJACENCY DATA
   11.1 Operation Code Definition (Columns 1-3)
   11.2 Initial Signal Identification Field
   11.3 Adjacent Nets
   11.4 Adjacency Continuation Record
   11.5 Subsequent Listing of Adjacencies
12 ELECTRICAL TEST MEASUREMENT DATA
   12.1 Controlled Impedance Test Information
   12.2 High Voltage Test Information
   12.3 Embedded and On-Board Passive Components and
        Measurements
13 SPECIAL AND NON-TEST FEATURES
   13.1 Operation Code Definition (Columns 1-3)
   13.2 Feature Type Name (Columns 4-17)
   13.3 Columns 18-38
   13.4 Columns 39-77
14 STEPPED IMAGES USING THE IMAGE PARAMETER
   14.1 Defining the Primary Image
   14.2 Defining a Stepped Image
   14.3 Rules of Step and Repeat
   14.4 Order of Operations
Appendix A Recommended File Content
Appendix B Completer List of Op-Codes
Appendix C ISO Code Character Set
Appendix E Native Language Codes
Appendix F End-Point Optimization
Figures and Tables