IPC DD 135 : 0

Name: IPC DD 135 : 0
Brand: IPC

Withdrawn

QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES

Withdrawn date

07-23-2013

Publisher

Institute of Printed Circuits

1 SCOPE
  1.1 Scope
  1.2 Purpose
  1.3 Classes
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 ASTM
3 PREPARATION FOR SPECIMENS FOR TEST
  3.1 Scope
  3.2 Specimen Configuration
  3.3 Precautions
  3.4 Apparatus
  3.5 Procedure
  3.6 Reporting of Specimen Processing History
4 MATERIAL PROPERTY TESTING AND REPORTING
  4.1 Notes
  4.2 Methods of Examination and Test
  4.3 Property Reporting
5 REFERENCES

Gives information about the deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.

DevelopmentNote	Also available in CD-ROM format. (09/2005)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Withdrawn

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