IPC DRM SMT : F2015
Current
The latest, up-to-date edition.
SURFACE MOUNT SOLDER JOINT EVALUATION TRAINING & REFERENCE GUIDE
04-14-2015
- Introduction
- Acceptance Criteria
- Classification
- Terminology
Chip Components
- Class 1 Dimensional Criteria
- Class 2 Dimensional Criteria
- Class 3 Dimensional Criteria
- Solder Conditions - Photos
J-Lead Components
- Class 1 Dimensional Criteria
- Class 2 Dimensional Criteria
- Class 3 Dimensional Criteria
- Solder Conditions - Photos
Gull Wing Components
- Class 1 Dimensional Criteria
- Class 2 Dimensional Criteria
- Class 3 Dimensional Criteria
- Solder Conditions - Photos
- Area Array Components
- BALL GRID ARRAYS (BGA)
- Bottom Termination Components (BTC)
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