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IPC EM 782 : 1996

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD SPREADSHEET

Withdrawn date

07-23-2013

Published date

01-12-2013

Provides appropriate size, shape and manufacturing tolerance of lands to ensure sufficient area for the formation of solder fillets, as described in IPC/EIA J-STD-001, which provide optimum electrical connections and permit inspection and test. Each component package and corresponding land pattern has been registered with a unique number. The land patterns accommodate all three performance classifications.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Withdrawn

IPC A 28 : LATEST SMT ASSEMBLY BENCHMARK ARTWORK
IPC A 49 : LATEST SURFACE MOUNT LAND PATTERN ROUND ROBIN ARTWORK - FILM FORMAT

IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC SM 782 : A1993 AMD 2 1999 SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

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