IPC HDBK 005 : 0

1 SCOPE
   1.1 Purpose
   1.2 Checklist
   1.3 Terms and Definitions
   1.4 Using Solder Paste
2 APPLICABLE DOCUMENTS
   2.1 IPC
   2.2 Joint Industry Standards
   2.3 Military
   2.4 International Electrotechnical Commission
        Documents
   2.5 Telcordia
   2.6 ASTM
3 SOLDERABILITY
   3.1 Theory of Wetting
   3.2 Degrees of Wetting
   3.3 Wetting Measurement
   3.4 Factors Affecting Solderability During
        Reflow Soldering Process
        3.4.1 Land Surface Finish
               3.4.1.1 Hot Air Solder Leveling (HASL)
               3.4.1.2 Plating/Immersion Coating
               3.4.1.3 Organic Solderability Preservatives
                       (OSP)
        3.4.2 Component Lead Composition/Finish
               3.4.2.1 Base Metal
               3.4.2.2 Coating Composition
                       3.4.2.2.1 Sn-Pb Coated Leads
                       3.4.2.2.2 Au Coated Leads
                       3.4.2.2.3 Pd or Pt Plated Leads
               3.4.2.3 Lead Coating Processes
        3.4.3 Reflow
        3.4.4 Solder Paste
               3.4.4.1 Flux
               3.4.4.2 Solder Alloy
               3.4.4.3 Powder Particle Size
        3.4.5 Summary
   3.5 Solderability Testing
        3.5.1 Solder Paste Wetting Tests
        3.5.2 Solderability Test Documents
               3.5.2.1 Special Solderability Test Methods
        3.5.3 Solderability Test Method Selection
4 PRINTING SOLDER PASTE
   4.1 Printing Needs
   4.2 Printing Variables
   4.3 Primary Control Variables
   4.4 Printing
        4.4.1 Apparatus
        4.4.2 Procedures
        4.4.3 Evaluation
   4.5 Solder Paste Print Quality Control Variables
        4.5.1 PCB Variables
        4.5.2 Solder Paste Variables
        4.5.3 Stencil Variables
        4.5.4 Screen Printer Variables
        4.5.5 Environmental and Operator Variables
5 ABILITY OF SOLDER PASTE TO RETAIN COMPONENTS
   (TACK)
   5.1 Background
   5.2 Tack Test Shortcomings
   5.3 Tack Life
   5.4 Increased Tack Strategies
   5.5 Increased Tack Life Strategies
   5.6 Control Variables
   5.7 Improved Testing
        5.7.1 Production Testing
        5.7.2 User Test Guidelines
6 SLUMP
   6.1 Slump Testing Apparatus
   6.2 Test Procedure
   6.3 Evaluation
        6.3.1 Cold Slump
        6.3.2 Hot Slump
        6.3.3 Slump Performance
        6.3.4 Visual Inspection
   6.4 Differentiation
   6.5 Major Control Variables
7 SOLDER PASTE FUME COLLECTION AND DISPOSAL
   7.1 Background
   7.2 Flux Vapor Collection
   7.3 Residue Toxicity
   7.4 Collection System Maintenance
8 SOLDER BALLS
   8.1 Solder Ball Tests
   8.2 Forms of Solder Balling
        8.2.1 Solder Beads
        8.2.2 Solder Paste Segregation
        8.2.3
        8.2.4 Lack of Coalescence
        8.2.5 Formulation Strategies
        8.2.6 Process Strategies
   8.3 Improved Testing
9 TOMBSTONING
   9.1 Tombstone Causes
   9.2 Minimizing Defects
10 CLEANABILITY OF SOLDER PASTES AND RESIDUES
   10.1 Cleaning Methods and Materials
11 COMPATIBILITY OF SOLDER PASTE FLUX RESIDUES
   (PROBE TESTABILITY)
   11.1 Test Plan Overview
   11.2 Approaches for Improved ATE-Compatibility
   11.3 Main Characteristics
   11.4 Major Control Variables
   11.5 Residue Open Time
   11.6 Temperature
   11.7 Reflow Conditions
   11.8 Test Points
        11.8.1 Test Probe Design and ATE Equipment
        11.8.2 Probe Build-up
        11.8.3 Residue Dryness
12 SHELF LIFE
   12.1 Test Procedures
   12.2 Evaluation
   12.3 Control Variables
APPENDIX A - Mass Reflow Assembly of 02\01 Components
APPENDIX B - Qualification of Solder Beading and
             Tombstoning in Passive Devices using
             Designed Experiments
APPENDIX C - A Materials Based Solution for the
             Elimination of Tombstones
Figures
Tables