IPC HDBK 610 : 0

Name: IPC HDBK 610 : 0
Brand: IPC

Withdrawn

HANDBOOK AND GUIDE TO SUPPLEMENT IPC-A-610 (INCLUDES IPC-A-610 B-C-D COMPARISONS

Withdrawn date

09-18-2023

Published date

10-01-2005

Publisher

Institute of Printed Circuits

1 Acceptability of Electronic Assemblies
   1.1 Scope
   1.2 Purpose
   1.3 Specialized Designs
   1.4 Terms & Definitions
   1.5 Examples and Illustrations
   1.6 Inspection Methodology
   1.7 Verification of Dimensions
   1.8 Magnification Aids and Lighting
2 Applicable Documents
   2.1 IPC Documents
   2.2 Joint Industry Documents
   2.3 EOS/ESD Association Documents
   2.4 Electronics Industries Alliance Documents
   2.5 International Electrotechnical Commission
        Documents
   2.6 Federal Standards
3 Handling Electronic Assemblies
   3.1 Electrical Overstress (EOS) Damage
        Prevention
   3.2 Electrostatic Discharge (ESD) Damage
        Prevention
   3.3 EOS/ESD Safe Workstation/EPA
   3.4 Handling
4 Mechanical Assembly
   4.1 Hardware
   4.2 Hardware Mounting
   4.3 Swaged Hardware
   4.4 Component Mounting
   4.5 Connectors, Handles, Extractors
   4.6 Heat Sink
   4.7 Terminals - Edge Clip
   4.8 Connector Pins
5 Component Installation Location/
   Orientation
   5.1 Orientation
   5.2 Mounting
   5.3 Lead Forming
   5.4 Damage
   5.5 Terminals
   5.6 Insulation
   5.7 Conductor
6 Soldering
   6.1 Soldering Acceptability Requirements
   6.2 Lead Protrusion
   6.3 Plated-Through Holes (PTH) (Supported
        Holes)
   6.4 Unsupported Holes
   6.5 Other
   6.6 Terminals
   6.7 Insulation
   6.8 High Voltage
   6.9 Connector Pins - Press-Fit Pins
   6.10 Gold Fingers
7 Cleanliness
   7.1 Flux Residues
   7.2 Particulate Matter
   7.3 Chlorides, Carbonates, and White Residues
   7.4 Flux Residues - No Clean Process
        Appearance
   7.5 Surface Appearance
8 Marking
   8.1 Etched Marking (including Hand Printing)
   8.2 Screened Marking
   8.3 Stamped Marking
   8.4 Laser Marking
   8.5 Labels
9 Coatings
   9.1 Conformal Coating
   9.2 Solder Resist Coating
10 Laminate Conditions
   10.1 Introduction
   10.2 Laminate Damage
   10.3 Flexible and Rigid-Flex Printed Wiring
   10.4 Solder Resist Discoloration
   10.5 Burns
   10.6 Bow and Twist
   10.7 Conductor/Land Damage
11 Discrete Wiring
   11.1 Solderless Wrap
   11.2 Jumper Wires
12 Surface Mount Assemblies
   12.1 Staking Adhesive
   12.2 Solder Joints
   12.3 Chip Component - Termination Variations
   12.4 SMT Soldering Anomalies
Appendix A Electrical Conductor Spacing Appendix A
Appendix B Metric Conversion Information, Appendix H-1
Appendix C Comparison of IPC-A-610 Revision B to C
Appendix D U.S. Department of Defense Adoption
            Notice

Provides IPC-A-610 change history and cross reference support along with the previous Rev B to C content. Also offers explanatory and tutorial information to help with the understanding the requirements of IPC-A-610.

Committee	7-30
DevelopmentNote	To be used in conjunction with IPC HDBK 001 and J STD 001. (06/2003) Also available in CD-ROM format. (09/2005) 2005 version incorporates Amendment 1 to 2002 version. (12/2005)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Withdrawn

BS EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IEC 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

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