Name: IPC HDBK 850 : 0
Brand: IPC

GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY

Published date

07-31-2012

Publisher

Institute of Printed Circuits

1 SCOPE
2 APPLICABLE DOCUMENTS
3 P/E MATERIALS
4 ELECTRICAL CONSIDERATIONS
5 REWORK AND REPAIR
6 END USE ENVIRONMENT
7 LONG TERM RELIABILITY AND TESTING
8 EQUIPMENT CONSIDERATIONS
9 DESIGN CONSIDERATIONS IN P/E
10 ENCLOSURE CONSIDERATIONS
11 PREPARATION FOR P/E
12 DISPENSING
13 CURE MECHANISMS
14 APPLICATION PROCESS MONITORING
15 ENVIRONMENTAL, HEALTH AND SAFETY PROCESSING CONSIDERATIONS
16 INHIBITION
17 POTTING/COATING OVER ENCAPSULANTS
18 MATERIALS RELATED TO LEAD FREE PROCESSING THAT
AFFECT P/E
19 REWORK AND REPAIR PROCESSES
20 REGULATIONS
APPENDIX A - MSDS
APPENDIX B - Reference Documents

Helps the designers and users of potting and encapsulation in understanding the characteristics of various materials, as well as the factors that can modify those characteristics when the potting or encapsulation is applied.

DevelopmentNote	Also available in CD-ROM format. (05/2016) Also available in Hardcopy format. (01/2018)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Current

IPC HDBK 830 : A	GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
SAE AS 12500 : 2018	CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES

IPC HDBK 830 : A	GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
IEC 61086-2:2004	Coatings for loaded printed wire boards (conformal coatings) - Part 2: Methods of test
IPC J STD 001 : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IEC 61086-3-1:2004	Coatings for loaded printed wire boards (conformal coatings) - Part 3-1: Specifications for individual materials - Coatings for general purpose (Class 1), high reliability (Class 2) and aerospace (Class 3)
IPC CC 830 : B	QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
ASTM E 595 : 2015 : REDLINE	Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment
IPC TM 650 : 0	TEST METHODS MANUAL
ASTM D 5470 : 2017 : REDLINE	Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials
IPC CH 65 : B	GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
IPC D 279 : 0	DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC 7711/21 : B	REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
ASTM D 2520 : 2013	Standard Test Methods for Complex Permittivity (Dielectric Constant) of Solid Electrical Insulating Materials at Microwave Frequencies and Temperatures to 1650<sup>o</sup>C
MIL-STD-202 Revision H:2015	ELECTRONIC AND ELECTRICAL COMPONENT PARTS
ASTM D 570 : 1998 : R2018	Standard Test Method for Water Absorption of Plastics
BS EN 61086-1:2004	Coatings for loaded printed wire boards (conformal coatings) Definitions, classification and general requirements
ASTM F 1249 : 2013 : REDLINE	Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modulated Infrared Sensor
IEC 61086-1:2004	Coatings for loaded printed wire boards (conformal coatings) - Part 1: Definitions, classification and general requirements