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IPC J-STD-075 : 2008

Current

Current

The latest, up-to-date edition.

Classification of Non-IC Electronic Components for Assembly Processes

Published date

03-09-2008

J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

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