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IPC MF 150 : F AMD 1

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

METAL FOIL FOR PRINTED WIRING APPLICATIONS

Superseded date

05-01-2000

Published date

11-23-2012

Covers unsupported electrodeposited copper foil, aluminum or copper carrier supported electrodeposited copper foil and wrought copper foil suitable for subsequent use in printed boards. The following topics are covered: functional classes; copper weight; bonding treatment. AMD 1 IS AVAILABLE FROM IPC FOR #15.13

DevelopmentNote
Supersedes IPC FC 150 (07/2004)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

MIL P 13949 : G (1) SUPP 1 SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR
QQ-S-571 Revision F:1994 SOLDER, ELECTRONIC (96 TO 485 DEGREES C)
I.S. EN 16602-70-11:2015 SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS
IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
MIL-PRF-26514 Revision G:1995 POLYURETHANE FOAM, RIGID OR FLEXIBLE, FOR PACKAGING
MIL-S-13949 Revision H:1993 SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR
IEC PAS 62249:2001 Qualification and performance specification for flexible printed boards
EN 16602-70-11:2015 Space product assurance - Procurement of printed circuit boards
BS EN 16602-70-11:2015 Space product assurance. Procurement of printed circuit boards

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