IPC RB 276 : 92 AMD 1 94

1.0 Scope
1.1 Scope
1.2 Purpose
1.3 Classification
1.4 Dimensions and tolerances
1.5 Statistical process control (SPC)
1.6 Interpretation
1.7 Contractual agreements
2.0 Applicable documents
2.1 IPC
2.2 Joint industry standards
2.3 Military
2.4 Federal
2.5 Other publications
3.0 Requirements
3.1 General
3.2 Terms and definitions
3.3 Conflict
3.4 Qualification and performance
3.5 Material
3.6 Visual examination
3.7 Board dimensional requirements
3.8 Conductor definition
3.9 Structural integrity
3.10 Plated-through holes after stress
3.11 Solder resist (solder mask) requirements
3.12 Electrical requirements
3.13 Environmental
3.14 Special requirements
3.15 Repair
4.0 Quality assurance provisions
4.1 Responsibility for inspection
4.2 Categories of inspection
4.3 Qualification testing
4.4 Production master inspection
4.5 Materials inspection
4.6 Quality conformance inspection
4.7 Statistical process control (SPC)
4.8 Reliability test and evaluation
5.0 Preparation for delivery
5.1 Packaging
5.2 Marking
6.0 Notes
6.1 Ordering data
Figures
1 Coupon F
2 Registration test coupon R
3A Breakout of 90 deg. and 180 deg.
3B Conductor width reduction
4 Negative etchback
5 Outgrowth, overhand and undercut
6 Annular ring measurement and thermal plane spacing
7 Crack definition
8 Typical microsection evaluation specimen (three
      plated-through holes)
9 Solder resist coverage
Tables
1 Bonding materials
2 Metal core substrates
3 Surface plating/coating
4 Plating voids - visual examination
5 Edge board contact gap
6 Minimum external annular rings
7 Allowable width reductions
8 Conductor spacing reduction
9 Plated integrity in plated-through holes prior to
      stress
10 Plated-through hole integrity after stress
11 Solder resist adhesion
12 Dielectric withstanding test voltages
13 Insulation resistance
14 Qualification testing
15 Coupon frequency requirements
16 Sampling plan for equipment classes per lot size
17 Quality conformance testing and frequency
18 Reliability assurance inspection