Name: IPC SM 840 : E
Brand: IPC

QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS

Published date

12-22-2010

Publisher

Institute of Printed Circuits

1 SCOPE AND DESIGNATION
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PREPARATION OF SOLDER MASK OR COVER MATERIAL FOR
DELIVERY
6 NOTES

Specifies the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. Also specifies two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements.

DevelopmentNote	Included in IPC C 105 & IPC C 1000. (08/2008) Also available in Chinese Language, See IPC SM 840 CHINESE. (11/2012) Also numbered as IEC PAS 61249-8-5. (06/2014)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Current
Supersedes	IPC SM 840 : D

DOD-STD-2000-1 Revision B:1986	SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY
IPC A 25 : A1996	MULTIPURPOSE 1 AND 2 SIDED TEST PATTERN
IEC PAS 62250:2001	Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IPC AJ 820 : A	ASSEMBLY AND JOINING HANDBOOK
IPC 6012 RUSSIAN : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC A 610 DANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 SPANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ROMANIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 2223 CHINESE : C	SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
IPC A 600 SWEDISH : H	ACCEPTABILITY OF PRINTED BOARDS
IPC A 600 JAPANESE : H	ACCEPTABILITY OF PRINTED BOARDS
IPC A 600 CHINESE : G	ACCEPTABILITY OF PRINTED BOARDS
IPC 6012 POLISH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC A 600 GERMAN : H	ACCEPTABILITY OF PRINTED BOARDS
IPC D 279 : 0	DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC A 610 CZECH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 GERMAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 600 POLISH : H	ACCEPTABILITY OF PRINTED BOARDS
IPC A 610 HINDI : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 600 RUSSIAN : H	ACCEPTABILITY OF PRINTED BOARDS
MIL-STD-2000 Revision A:1991	STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 ESTONIAN : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 POLISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 DUTCH : F2014	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 KOREAN : F2014	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 6010 SERIES : LATEST	IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
IPC 4761 : 0	DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES
IPC A 610 ITALIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 FRENCH : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 2223 GERMAN : C	SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
IPC HDBK 830 : A	GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
IPC A 610 SWEDISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HUNGARIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 6013 GERMAN : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC HDBK 840 : 0	SOLDER MASK HANDBOOK
IPC 6012 FRENCH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC D 949 : 1987	RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR,
IPC MI 660 : 1984	INCOMING INSPECTION OF RAW MATERIALS MANUAL
IPC A 610 CHINESE : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 TURKISH : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 JAPANESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 600 FRENCH : H	ACCEPTABILITY OF PRINTED BOARDS
IPC A 610 RUSSIAN : D	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC QE 605 : A	PRINTED BOARD QUALITY EVALUATION HANDBOOK
IPC 6018 CHINESE : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
IPC A 610 VIETNAMESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
MIL-A-28870 Revision A:1990	ASSEMBLIES, ELECTRICAL BACKPLANE, PRINTED WIRING, GENERAL SPECIFICATION FOR
IPC SM 784 : 0	GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION
BS EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
IPC 6015 : 0	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES
IEC TR 62866:2014	Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
NASA MSFC STD 2907 : 2006	WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS
MIL-STD-2118 Base Document:1984	FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR
IEC 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
PD IEC/TR 62866:2014	Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
IEC PAS 62249:2001	Qualification and performance specification for flexible printed boards
MIL-STD-2119 Revision A:1990	DESIGN REQUIREMENTS FOR PRINTED WIRING ELECTRICAL BACKPLANE ASSEMBLIES
MIL-C-28859 Revision B:1990	CONNECTOR COMPONENT PART, ELECTRICAL BACK PLANE, PRINTED WIRING, GENERAL SPECIFICATION FOR

IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 6018 : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARDS
ASTM E 595 : 2015 : REDLINE	Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment
IPC J STD 006 : C	REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC J STD 004 : B	REQUIREMENTS FOR SOLDERING FLUXES
IPC TM 650 : 0	TEST METHODS MANUAL
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC QL 653 : A	Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
IPC J STD 003 : C	SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC 6013 : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
IPC A 25 : A1996	MULTIPURPOSE 1 AND 2 SIDED TEST PATTERN
IPC 6012 : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS