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IPC SMC WP 003 : 1993

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

CHIP MOUNTING TECHNOLOGY (CMT)

Withdrawn date

10-04-2023

Published date

08-01-1993

Discusses technology status on various methods for mounting and interconnecting active devices to various substrate materials. Reviews current mounting techniques of tape automated bonding (TAB) chip on board (COB) and flip chip. Also covers examinations of the most frequently used substrate options of laminate, ceramic and silicon.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Withdrawn
Supersedes

IPC TR 001 : 1989 AN INTRODUCTION TO TAPE AUTOMATED BONDING FINE PITCH TECHNOLOGY

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