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IPC SP 819 : 1988

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SPECIFICATION FOR SOLDER PASTES

Superseded date

01-01-1995

Published date

11-23-2012

Prescribes general requirements for the description and testing of solder paste used in the soldering of surface-mount components or in the general soldering of electronic interconnections. It defines the characteristics of solder paste through the definition of properties and the specification of test methods and inspection criteria. The materials covered include solder powder and solder-paste flux that are blended together to produce a solder paste. The solder powders are classified as to the shape and the size distribution of the particles.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

IPC S 815 : B1987 GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS
QQ-S-571 Revision F:1994 SOLDER, ELECTRONIC (96 TO 485 DEGREES C)
MIL-F-14256 Revision F:1993 FLUX, SOLDERING, LIQUID (ROSIN BASE)

QQ-S-571 Revision F:1994 SOLDER, ELECTRONIC (96 TO 485 DEGREES C)

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