TEST METHODS MANUAL

Available format(s)

Hardcopy

Language(s)

English

Published date

06-06-2012

Publisher

Institute of Printed Circuits

Includes over 150 industry-consensus procedures for electrical, environmental, mechanical, and chemical test on types of printed wiring boards and connectors.

DocumentType	Standard
ISBN	1-580981-38-0
Pages	0
PublisherName	Institute of Printed Circuits
Status	Current

MIL-STD-2166 Base Document:1984	CONNECTION, ELECTRICAL COMPLAINT PIN
IPC 9151 : D	PRINTED BOARD PROCESS CAPABILITY, QUALITY, AND RELATIVE RELIABILITY (PCQR[2]) BENCHMARK TEST STANDARD AND DATABASE
15/30331587 DC : 0	BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
BS EN IEC 61189-5-503:2017	Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
IPC 6017 : 0	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR PRINTED BOARDS CONTAINING EMBEDDED PASSIVE DEVICES
MIL P 13949 : G (1) SUPP 1	SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR
IEC PAS 62190:2000	Moisture/reflow sensivity classification for nonhermetic solid state surface mount devices
IEC 61189-5-503:2017	Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
I.S. EN 61191-2:2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
BS EN 61191-3:2017	Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
IEC PAS 62250:2001	Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
PD IEC/PAS 61249-8-1:2014	Qualification and performance of electrical insulating compound for printed wiring assemblies
IEC 61191-4:2017	Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
BS EN 61191-1:2013	Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
EN 61189-5-503:2017	Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
I.S. EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
IPC J STD 002 CHINESE : C	SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IPC 2222 GERMAN : A	SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
IPC 2222 FRENCH : A2010	SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
MIL-PRF-50884 Revision F:2014	Printed Wiring Board, Flexible or Rigid-Flex, General Specification for
IPC FC 250 : A1986	SPECIFICATION FOR SINGLE AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING
IPC 4554 CHINESE : -	SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS
IPC AJ 820 : A	ASSEMBLY AND JOINING HANDBOOK
MIL-C-28809 Revision B:1988	CIRCUIT CARD ASSEMBLIES, RIGID, FLEXIBLE & RIGID FLEX
IPC 6012 RUSSIAN : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC J STD 001 SWEDISH : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 DANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 003 CHINESE : B	SOLDERABILITY TESTS FOR PRINTED BOARDS
MIL P 50884 : E	PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR
IPC J STD 001 RUSSIAN : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 SPANISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC S 815 : B1987	GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS
IPC SPVC-LAT1 : 2010	ANALYTICAL PROCEDURES FOR PORTABLE LEAD-FREE ALLOY TEST DATA
MIL-PRF-71226 Base Document:1996	ARMAMENTS AND MUNITIONS, STANDARD PROVISIONS, GENERAL SPECIFICATION FOR
IPC J STD 005 RUSSIAN : A	REQUIREMENTS FOR SOLDERING FLUXES
IPC J STD 001 TURKISH : E2010	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 004 RUSSIAN : B	REQUIREMENTS FOR SOLDERING FLUXES
IPC J STD 001 POLISH : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 ROMANIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 2223 CHINESE : C	SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
IPC A 600 SWEDISH : H	ACCEPTABILITY OF PRINTED BOARDS
IPC A 600 JAPANESE : H	ACCEPTABILITY OF PRINTED BOARDS
IPC A 600 CHINESE : G	ACCEPTABILITY OF PRINTED BOARDS
IPC 2221 GERMAN : B	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 1601 GERMAN : -	PRINTED BOARD HANDLING AND STORAGE GUIDELINES
IPC 6012 POLISH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC QL 653 : A	Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
MIL-PRF-55110 Revision H:2014	Printed Wiring Board, Rigid, General Specification for
IPC 9241 : 2016	GUIDELINES FOR MICROSECTION PREPARATION
MIL-PRF-31032-2 Revision C:2017	PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING
IPC 7092 : 0	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
IPC A 600 GERMAN : H	ACCEPTABILITY OF PRINTED BOARDS
IPC A 610 CZECH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
MIL-PRF-31032-1 Revision D:2017	PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING
IPC A 610 GERMAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 600 POLISH : H	ACCEPTABILITY OF PRINTED BOARDS
IPC A 610 HINDI : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 5704 : 0	CLEANLINESS REQUIREMENTS FOR UNPOPULATED PRINTED BOARDS
IPC A 600 RUSSIAN : H	ACCEPTABILITY OF PRINTED BOARDS
IPC 2222 CHINESE : A	SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
IPC 5702 : 0	GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS
IPC A 610 ESTONIAN : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 POLISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 DUTCH : F2014	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC CH 65 : B	GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
IPC 4204 CHINESE : A2011 AMD 1 2013	FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
MIL-F-14256 Revision F:1993	FLUX, SOLDERING, LIQUID (ROSIN BASE)
IPC CH 65 CHINESE : B	GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
MIL-P-46843 Revision C:1989	PRINTED WIRING ASSEMBLIES PRODUCTION OF
MIL-DTL-917 Revision F:2014	ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS FOR
IPC A 610 ITALIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 FRENCH : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
MIL-PRF-31032-4 Revision C:2017	PRINTED WIRING BOARD, RIGID FLEX OR FLEXIBLE, MULTILAYER, WITH PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING
IPC A 610 KOREAN : F2014	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
MIL-PRF-31032-6 Revision B:2017	PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
IPC 2152 : 0	STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN
MIL-PRF-31032-3 Revision C:2017	PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING
IPC HDBK 850 : 0	GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY
IPC SM 840 : E	QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC 2223 GERMAN : C	SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS
IPC A 630 CHINESE : -	ACCEPTABILITY STANDARD FOR MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES
IPC HDBK 830 : A	GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS
IPC CC 830 : B	QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
IPC J STD 001 HUNGARIAN : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
MIL-PRF-31032-5 Revision B:2017	PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
IPC J STD 004 CHINESE : B	REQUIREMENTS FOR SOLDERING FLUXES
IPC J STD 001 GERMAN : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 9203 : 0	USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE
IPC A 610 SWEDISH : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 003 : C	SOLDERABILITY TESTS FOR PRINTED BOARDS
IPC SM 840 CHINESE : E	QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC A 610 HUNGARIAN : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC HDBK 840 : 0	SOLDER MASK HANDBOOK
IPC 6012 FRENCH : C	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 4204 : A	FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
IPC D 949 : 1987	RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR,
IPC A 610 CHINESE : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 2141 : A	DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS
IPC 4556 : 0	SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS
IPC 4202 CHINESE : A	FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED CIRCUITRY
IPC 6013 GERMAN : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC J STD 006 CHINESE : B-2	REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC J STD 001 ROMANIAN : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 005 : A	REQUIREMENTS FOR SOLDERING PASTES
IPC A 610 JAPANESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 VIETNAMESE : E	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 005 CHINESE : A	REQUIREMENTS FOR SOLDERING PASTES
IPC J STD 001 DANISH : E	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 600 FRENCH : H	ACCEPTABILITY OF PRINTED BOARDS
IPC 4101 CHINESE : C2009	SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC FC 221 : A1984	SPECIFICATION FOR FLAT COPPER CONDUCTORS FOR FLAT CABLES
IPC A 610 RUSSIAN : D	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 TURKISH : E2010	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 6018 CHINESE : B	QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
IPC 4101 GERMAN : C	SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC FC 213 : 1984	PERFORMANCE SPECIFICATION FOR FLAT UNDERCARPET TELEPHONE CABLE
18/30369151 DC : DRAFT MAY 2018	BS EN 62899-202-7 - PRINTED ELECTRONICS - PART 202-7: MATERIALS - CONDUCTIVE INK - MEASUREMENT OF PEEL STRENGTH FOR PRINTED CONDUCTIVE LAYER ON FLEXIBLE SUBSTRATE
IPC HDBK 4691 : 2015	HANDBOOK ON ADHESIVE BONDING IN ELECTRONIC ASSEMBLY OPERATIONS
SAE AS 6171/10 : 2016	TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY THERMOGRAVIMETRIC ANALYSIS (TGA) TEST METHODS
BS EN 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
13/30295427 DC : 0	BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
I.S. EN 61191-4:2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
IPC J STD 001 CHINESE : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
I.S. EN 61191-3:2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
IPC 2222 : A	SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
IPC J STD 001 SPANISH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 FRENCH : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 9202 : 0	MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE
MIL-S-13949 Revision H:1993	SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR
IPC 9631 : 0	USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION
IPC TM 650-MDP : 2012	IPC TEST METHOD DEVELOPMENT PACKET
GEIA HB 0005-2 : 2007	TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
IEC TR 62866:2014	Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
BS EN 61191-4:2017	Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
BS EN ISO 9455-17:2006	Soft soldering fluxes. Test methods Surface insulation resistance comb test and electrochemical migration test of flux residues
NASA GSFC STD 6001 : 2016	CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE
NASA MSFC STD 2907 : 2006	WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS
NASA GSFC STD 8002 : 2015	STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX
IPC 4562 : A	METAL FOIL FOR PRINTED BOARD APPLICATIONS
IPC 4554 : 0	SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS
IPC SM 817 : A	GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES
IPC A 630 : 0	ACCEPTABILITY STANDARD FOR MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES
IPC 9707 : 0	SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS
SAE AS 6171/9 : 2016	TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY FOURIER TRANSFORM INFRARED SPECTROSCOPY (FTIR) TEST METHODS
MIL-I-46838 Revision B:1981	INSULATING COMPOUND, ELECTRICAL, SILICONE RUBBER, ROOM TEMPERATURE VULCANIZING
IPC J STD 030 : A	SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS
CEI EN 61189-5-503 : 1ED 2017	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
IPC AM 372 : 1978	ELECTROLESS COPPER FILM FOR ADDITIVE PRINTED BOARDS,
ASTM D 3380 : 2014 : REDLINE	Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
IPC J STD 020 CHINESE : D-1	MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC PAS 61249-8-5:2014	Qualification and performance specification of permanent solder mask and flexible cover materials
15/30327712 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC 61189-5-1:2016	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
PD IEC/TR 62866:2014	Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
11/30255124 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC TS 62647-22:2013	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
IEC PAS 62647-22:2011	Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
ISO 9455-17:2002	Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
IEC PAS 62293:2001	Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
IEC PAS 62249:2001	Qualification and performance specification for flexible printed boards
PD IEC/PAS 63015:2016	Definition of “Low-Halogen?? for electronic products
IEC 61191-3:2017	Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
PD IEC/PAS 61249-8-5:2014	Qualification and performance specification of permanent solder mask and flexible cover materials
IPC J STD 004 : B	REQUIREMENTS FOR SOLDERING FLUXES
EN ISO 9455-17:2006	Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002)
MIL-I-47199 Revision A:1980	INSULATING COMPOUND, ELECTRICAL, LOW VISCOSITY, SILICONE RUBBER
BS ISO 9455-17 : 2002 AMD 16425	SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES
NASA STD 8739.1 : 2016	WORKMANSHIP STANDARD FOR POLYMERIC APPLICATION ON ELECTRONIC ASSEMBLIES
IPC 9204 : 2017	GUIDELINE ON FLEXIBILITY AND STRETCHABILITY TESTING FOR PRINTED ELECTRONICS
IPC 6801 : 0	IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS
IPC 4562 CHINESE : A	METAL FOIL FOR PRINTED BOARD APPLICATIONS
I.S. EN 61189-5-503:2017	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
EN 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC PAS 61249-8-1:2014	Qualification and performance of electrical insulating compound for printed wiring assemblies
13/30295424 DC : 0	BS IEC/PAS 61249-8-1 ED.1 - QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
PD IEC/TS 62647-22:2013	Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
EN 61191-3:2017	Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
EN 61191-1:2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
IPC J STD 006 : C	REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC 2221 FRENCH : B2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
EN 61191-4:2017	Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
I.S. EN ISO 9455-17:2006	SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES