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IPC J STD 030 : A

Current
Current

The latest, up-to-date edition.

SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS
Publisher

Institute of Printed Circuits

1 SCOPE
2 APPLICABLE DOCUMENTS
3 TERMS AND DEFINITIONS
4 BACKGROUND
5 MECHANICAL CONSIDERATIONS
6 UNCURED UNDERFILL CHARACTERISTICS
7 MATERIALS PACKAGING, HANDLING, AND STORAGE
8 APPLICATION PROCESS
9 CURE PROCESS
10 CURED UNDERFILL CHARACTERISTICS
11 WORKMANSHIP
12 PROCESS RELIABILITY ASSESSMENT
13 OTHER CONSIDERATIONS
14 TROUBLE SHOOTING

Gives users of underfill material with guidance in selecting and evaluating underfill material for assembly solder joints second level interconnects.

Committee
5-20
DevelopmentNote
Included in IPC C 103 & IPC C 1000. (08/2008) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
ASTM D 2471 : 1999 Standard Test Method for Gel Time and Peak Exothermic Temperature of Reacting Thermosetting Resins (Withdrawn 2008)
ASTM D 792 : 2013 : REDLINE Standard Test Methods for Density and Specific Gravity (Relative Density) of Plastics by Displacement
IPC TM 650 : 0 TEST METHODS MANUAL
IPC 7711/21 : B REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
ASTM D 257 : 2014 : REDLINE Standard Test Methods for DC Resistance or Conductance of Insulating Materials

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