IPC J STD 033C-1:2014

Superseded

View Superseded by

HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES

Available format(s)

Hardcopy

Superseded date

09-21-2023

Language(s)

English

Published date

08-01-2014

Publisher

Institute of Printed Circuits

1 FOREWORD
2 APPLICABLE DOCUMENTS (Normative)
3 DRY PACKING
4 DRYING
5 USE
6 BOARD REWORK
7 DERATING DUE TO FACTORY
  ENVIRONMENTAL CONDITIONS
APPENDIX A - Test Method for Reversible
             (Type 1) RH Spots on a
             Humidity Indictor Card (HIC)
             used with Electronic Device
             Packaging
APPENDIX B - Derivation of Bake Tables
APPENDIX C - Desiccant Unit Absorption
             Capacity Test Method for
             Verification
APPENDIX D - Changes in J-STD-033D

Gives manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075.

Committee	JC-14.1
DevelopmentNote	Supersedes IPC SM 786 & EIA JEP 124. B.1 2007 Edition is still available in Russian and Italian Languages, See separate records. (02/2012) C2012 Edition is still available in Hungarian, German & Chinese Languages, See separate records. (10/2014) Jointly Published by IPC and JEDEC. (05/2016)
DocumentType	Standard
Pages	28
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC/JEDEC J-STD-033D:2018
Supersedes	IPC J STD 033C:2012 IPC SM 786 : A1995

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