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IPC J STD 035 : 0

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS

Available format(s)

Hardcopy

Superseded date

03-11-2023

Language(s)

English

1 SCOPE
2 DEFINITIONS
  2.1 A-mode
  2.2 B-mode
  2.3 Back-Side Substrate View Area
  2.4 C-mode
  2.5 Through Transmission Mode
  2.6 Die Attach View Area
  2.7 Die Surface View Area
  2.8 Focal Length (FL)
  2.9 Focus Plane
  2.10 Leadframe (L/F) View Area
  2.11 Reflective Acoustic Microscope
  2.12 Through Transmission Acoustic Microscope
  2.13 Time-of-Flight (TOF)
  2.14 Top-Side Die Attach Substrate View Area
3 APPARATUS
  3.1 Reflective Acoustic Microscope System
  3.2 Through Transmission Acoustic Microscope System
4 PROCEDURE
  4.1 Equipment Setup
  4.2 Perform Acoustic Scans
Appendix A Acoustic Microscopy Defect Check Sheet
Appendix B Potential Image Pitfalls
Appendix C Some Limitations of Acoustic Microscopy
Appendix D Reference Procedure for Presenting Applicable
           Scanned Data

Specifies methods for performing acoustic microscopy on nonhermetic encapsulated electronic components. Gives to users with an acoustic microscopy process flow for detection of defects non-destructively in plastic packages, while achieving reproducibility.

Committee
TC 47
DevelopmentNote
Jointly published by IPC & JEDEC. (01/2018)
DocumentType
Standard
Pages
20
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

Standards Relationship
IEC PAS 62191:2000 Identical

SAE AS 6294/1 : 2017 REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN SPACE APPLICATIONS
SAE AS 6294/2 : 2018 REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN MILITARY AND AVIONICS APPLICATIONS
IEC PAS 62190:2000 Moisture/reflow sensivity classification for nonhermetic solid state surface mount devices
SAE AS 6171/6 : 2016 TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY ACOUSTIC MICROSCOPY (AM) TEST METHODS
IEC PAS 62686-1:2011 Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
IPC J STD 020 CHINESE : D-1 MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
IPC M 109 : LATEST COMPONENTS HANDLING MANUAL
DD IEC PAS 62686-1 : DRAFT JULY 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
PD IEC/TS 62686-1:2015 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
MIL-PRF-38534 Revision K:2017 HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR

IPC M 109 : LATEST COMPONENTS HANDLING MANUAL
IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IPC E 500 : LATEST IPC ELECTRONIC DOCUMENT COLLECTION

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