JEDEC JESD22-B102E:2007
Current
Current
The latest, up-to-date edition.
SOLDERABILITY
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
10-01-2007
Publisher
This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations.
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