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JIS C 6494:1999

JIS C 6494:1999

Current

Current

The latest, up-to-date edition.

Base materials for printed circuits - Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Available format(s)

Hardcopy , PDF

Language(s)

English, Japanese

Published date

02-29-2000

Publisher

Japanese Standards Association

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This specification gives requirements for properties of thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical fire resistance) for use in the fabrication of multilayer printed boards. Laminated sheets covered by this specification have thicknesses (of the base laminate, excluding the copper foil) not greater than 0.8 mm. Although primarily intended for multilayer boards, the materials may be used for single-sided or double-sided printed boards.

DocumentType
Standard
Pages
10
PublisherName
Japanese Standards Association
Status
Current

Reaffirmed 2014 1999(R2014) [20/10/2014]1999(R2009) [01/10/2009]1999 [20/11/1999]1994 [01/08/1994]

JIS C 6481:1996 Test methods of copper-clad laminates for printed wiring boards
JIS C 6515:1998 Copper foil for printed wiring boards

JIS C 6524:1995 Prepreg for multilayer printed wiring boards - Bismaleimide/Triazine/Epoxide resin-impregnated glass cloth

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Hardcopy - English
PDF - English
Hardcopy - Japanese
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