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JIS H 8646:1991

JIS H 8646:1991

Current

Current

The latest, up-to-date edition.

Electroless copper platings

Available format(s)

Hardcopy , PDF

Language(s)

Japanese, English

Published date

03-31-1991

Publisher

Japanese Standards Association

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This Japanese Industrial Standard specifies the electroless copper plating (hereafter referred to as the "plating") 5 mum or thicker used for printed wiring boards by additive process.

DocumentType
Standard
Pages
0
PublisherName
Japanese Standards Association
Status
Current

Reaffirmed 2015 91(R2015) [20/10/2015]91(R2010) [01/10/2010]91(R2000) [20/09/2000]91 [01/06/1991]

JIS Z 8902:1984 Xenon standard white light source
JIS H 1051:2005 Methods for determination of copper in copper and copper alloys
JIS H 0400:1998 Glossary of terms used in electroplating and related processes
JIS B 7502:1994 Micrometer callipers
JIS K 1308:1983 Nitric acid
JIS R 6253:2006 Waterproof abrasive papers
JIS B 7507:1993 Vernier, dial and digital callipers
JIS B 7721:2002 Verification and calibration of the force measuring system of the tension/compression testing machines
JIS P 8115:2001 Paper and board - Determination of folding endurance - MIT method
JIS C 5012:1993 Test methods for printed wiring boards
JIS C 6480:1994 General rules of copper-clad laminates for printed wiring boards

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Hardcopy - Japanese
Hardcopy - English
PDF - English
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