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JIS Z 3197:1999

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Testing methods for soldering fluxes
Available format(s)

Hardcopy , PDF

Superseded date

12-23-2016

Language(s)

Japanese, English

Published date

03-20-1999

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This Japanese Industrial Standard specifies the testing method for soldering fluxes mainly used for wiring electric equipments, electronic equipments, communication equipments, and parts and components of these equipments.

DocumentType
Standard
Pages
0
PublisherName
Japanese Standards Association
Status
Superseded
SupersededBy

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JIS Z 3198-6:2003 Test methods for lead-free solders Part 6: Methods for 45°pull test of solder joints on QFP lead
JIS C 0099:2005 Environmental testing: Tests - Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
JIS Z 3198-7:2003 Test methods for lead-free solders -- Part 7: Methods for shear strength of solder joints on chip components Part 7: Methods for shear strength of solder joints on chip components
JIS Z 3283:2006 Resin flux cored solders
JIS Z 3284:1994 Solder paste
JIS C 61191-1:2006 Printed Board Assemblies - Part 1: Generic Specification - Requirements For Soldered Electrical And Electronic Assemblies Using Surface Mount And Related Assembly Technologies

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