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JIS Z 3198-7:2003

Current
Current

The latest, up-to-date edition.

Test methods for lead-free solders -- Part 7: Methods for shear strength of solder joints on chip components Part 7: Methods for shear strength of solder joints on chip components
Available format(s)

Hardcopy , PDF

Language(s)

Japanese, English

Published date

06-20-2003

Publisher

Japanese Standards Association

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This Standard specifies test methods for shear strength of solder joints on chip components by using lead-free solder to be used principally for wiring connection of electrical machining and apparatus, electronic apparatus, communication equipment or the like, wiring connection of components and the like.

DocumentType
Test Method
Pages
0
PublisherName
Japanese Standards Association
Status
Current

Reaffirmed 2013 2003(R2013) [21/10/2013]2003(R2008) [01/10/2008]2003 [20/06/2003]

JIS Z 3197:1999 Testing methods for soldering fluxes
JIS Z 3284:1994 Solder paste
JIS Z 3283:2006 Resin flux cored solders

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Hardcopy - Japanese
Hardcopy - English
PDF - English
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