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JIS Z 3284-2:2014

JIS Z 3284-2:2014

Current

Current

The latest, up-to-date edition.

Solder Paste - Part 2: Test Methods For Solder Particle Shape, Surface Condition Judgment, And Particle Size Distribution

Available format(s)

Hardcopy , PDF

Language(s)

English, Japanese

Published date

06-20-2014

Publisher

Japanese Standards Association

Introduction1 Scope2 Normative references3 Terms and definitions4 Test methodsAnnex A (normative) - Characteristics evaluation table of solder pasteAnnex JA (informative) - Comparison table between JIS and corresponding International Standard

Describes the shape, surface condition judgment test and particle size distribution measurement test of the solder particles of solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.

DocumentType
Test Method
Pages
17
ProductNote
Supersedes JIS Z3284. (06/2014)
PublisherName
Japanese Standards Association
Status
Current
Supersedes

2014 [20/06/2014]

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Hardcopy - English
PDF - English
Hardcopy - Japanese
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