MIL-C-47224 Revision B Notice 2 - Validation:2018
Current
Current
The latest, up-to-date edition.
COMPOUND, MOLDING, TRANSFER, EPOXY RESIN, SINGLE COMPONENT
Amendment of
Available format(s)
PDF
Language(s)
English
Published date
04-25-2018
Publisher
This specification covers one type of single-component, epoxy resin transfer molding compound for encapsulating, potting, and embedding electrical devices requiring good thermal conductivity.
Important note : All end users must be registered with an Account prior to user licenses being assigned.Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.