MIL-DTL-47113 Revision E Notice 2 - Validation:2022
Current
Current
The latest, up-to-date edition.
Compound, Heat Sink, Silicone and/or Non-Silicone
Amendment of
Available format(s)
PDF
Language(s)
English
Published date
05-11-2022
Publisher
This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal.
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