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MIL-PRF-31032 Revision C:2016

MIL-PRF-31032 Revision C:2016

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Printed Circuit Board/Printed Wiring Board, General Specification for

Available format(s)

PDF

Superseded date

05-07-2021

Language(s)

English

Published date

11-16-2016

Publisher

US Military Specs/Standards/Handbooks

1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
APPENDIX A - THE QUALITY MANAGEMENT (QM) PROGRAM
APPENDIX B - QUALIFICATION
APPENDIX C - CONFORMANCE INSPECTION
APPENDIX D - TEST OPTIMIZATION
APPENDIX E - STATISTICAL SAMPLING, TEST, AND INSPECTION
             PROCEDURES
APPENDIX F - TEST METHOD: RESISTANCE TO SOLDERING HEAT
APPENDIX G - TEST METHOD: SEQUENTIAL ELECTROCHEMICAL
             REDUCTION ANALYSIS (SERA) SOLDERABILITY
APPENDIX H - TEST METHOD: SOLDER FLOAT SOLDERABILITY
APPENDIX J - SOLDERABILITY TESTING

Determines the general performance requirements for printed circuit boards or printed wiring boards and the verification requirements for insuring that these items meet the applicable performance requirements.

This specification establishes the general performance requirements for printed circuit boards or printed wiring boards (hereafter designated printed board) and the verification requirements for insuring that these items meet the applicable performance requirements. Certification and qualification to this specification allows manufacturer’s to apply the Qualified Manufacturers List (QML) (see 6.4.32) program to printed boards procured to non−QML documents such as MIL−PRF−55110 and MIL−PRF−50884 (see 6.3.5 and 6.5). The intent of this specification is to allow the printed board manufacturer the flexibility to implement best commercial practices to the maximum extent possible while still providing product that meets military performance needs (see 6.3.4). The principle concepts which allow this flexibility are as follows:
The manufacturer forms an internal quality review system or organization referred to in this document as the Technical Review Board (TRB) (see 6.4.51). The TRB is responsible for the implementation of a quality management (QM) plan (see 6.4.41). The implemented QM plan becomes the manufacturer’s quality management (QM) program (see 6.4.42).
b. A relationship is established between the manufacturer (see 6.4.18) and the qualifying activity (see 6.4.37).

DocumentType
Standard
Pages
94
PublisherName
US Military Specs/Standards/Handbooks
Status
Superseded
SupersededBy

MIL-PRF-50884 Revision F:2014 Printed Wiring Board, Flexible or Rigid-Flex, General Specification for
MIL P 50884 : E PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR
MIL-PRF-55110 Revision H:2014 Printed Wiring Board, Rigid, General Specification for
MIL-PRF-31032-2 Revision C:2017 PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING
MIL-PRF-31032-1 Revision D:2017 PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING
MIL-STD-1353 Revision C:2014 ELECTRICAL CONNECTORS, PLUG-IN SOCKETS AND ASSOCIATED HARDWARE, SELECTION AND USE OF
MIL-PRF-31032-4 Revision C:2017 PRINTED WIRING BOARD, RIGID FLEX OR FLEXIBLE, MULTILAYER, WITH PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING
MIL-PRF-31032-6 Revision B:2017 PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
MIL-DTL-917 Revision F:2014 ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS FOR
MIL-PRF-31032-3 Revision C:2017 PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING
MIL-PRF-31032-5 Revision B:2017 PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
IEEE DRAFT 1505 : 0 RECEIVER FIXTURE INTERFACE SPONSORED BY THE CONNECTORS TECHNICAL COMMITTEE TC-55 OF THE IEEE INSTRUMENTATION & MEASUREMENT SOCIETY
BS IEC 63004:2015 Standard for receiver fixture interface
MIL-STD-13231 Base Document:1999 MARKING OF ELECTRONIC ITEMS
NASA MSFC STD 2907 : 2006 WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS
NASA JSC 27301 : 2009 MATERIALS AND PROCESSES SELECTION, CONTROL, AND IMPLEMENTATION PLAN FOR JSC FLIGHT HARDWARE
MIL-DTL-55302 Revision G:2009 CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES
MIL-DTL-83739 Revision D:2012 SWITCHES, ANTENNA, RADIO FREQUENCY, SOLID-STATE, GENERAL SPECIFICATION FOR
MIL-DTL-21097-14 Revision F:2005 CONNECTORS, ELECTRICAL, PRINTED WIRING BOARD MALE ADAPTER, CONTACT SPACING: 0.200, ALTERNATE DUAL ROW, TYPE CS, BLADE CONTACT (MOUNTING PROVISION A)
MIL-DTL-21097-3 Revision F:2005 CONNECTORS, ELECTRICAL, PRINTED WIRING BOARD COMPOSITE, ADAPTER, CONTACT SPACING (.200) INDIVIDUAL CONTACTS, TYPE CS
IEC 63004:2015 Standard for receiver fixture interface
MIL-PRF-55310 Revision E:2006 OSCILLATOR, CRYSTAL CONTROLLED, GENERAL SPECIFICATION FOR
MIL-DTL-28875 Revision C:2012 Amplifiers, Radio-Frequency and Microwave, Solid-State, General Specification for
MIL-HDBK-1861 Revision B:2013 Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
ISO/IEC 17025:2005 General requirements for the competence of testing and calibration laboratories
ANSI/NCSL Z540 3 : 2006(R2013) REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT
ISO 14253-1:2017 Geometrical product specifications (GPS) — Inspection by measurement of workpieces and measuring equipment — Part 1: Decision rules for verifying conformity or nonconformity with specifications
ASME B89.7.3.2 : 2007 GUIDELINES FOR THE EVALUATION OF DIMENSIONAL MEASUREMENT UNCERTAINTY
IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
IPC J STD 005 : A REQUIREMENTS FOR SOLDERING PASTES
EIA 585 : 1991 ZERO ACCEPTANCE NUMBER SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES OF ISOLATED LOTS
IPC QL 653 : A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
IEC 61326-2-1:2012 Electrical equipment for measurement, control and laboratory use - EMC requirements - Part 2-1: Particular requirements - Test configurations, operational conditions and performance criteria for sensitive test and measurement equipment for EMC unprotected applications
IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
EIA 557 : 2006 STATISTICAL PROCESS CONTROL SYSTEMS
MIL A-A-59282 : 1998 CHEMICALS, ANALYTICAL; GENERAL SPECIFICATION FOR
ANSI/NCSL Z540 2 : 1997(R2012) U.S. GUIDE TO EXPRESSION OF UNCERTAINTY IN MEASUREMENT
IPC 9191 : 0 GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
ISO/IEC Guide 98-3:2008 Uncertainty of measurement — Part 3: Guide to the expression of uncertainty in measurement (GUM:1995)

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