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MIL S 19491 : G

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SEMICONDUCTOR DEVICE, PACKAGING OF
Available format(s)

PDF

Superseded date

06-28-2002

Details requirements for the preservation, packing and container marking of all types of semiconductor devices (e.g., junction field effect transistors, microwave diodes and light emitting diode fiber optic sources) in FSC's 5961 and 6030 and associated accessories in FSC 5999. Coverage includes applicable documents, hardware, physical protection, cleaning, drying, preservatives, and semiconductor devices.

Committee
AREA PACK
DocumentType
Standard
Pages
13
PublisherName
US Military Specs/Standards/Handbooks
Status
Superseded
SupersededBy

MIL-M-38527 Revision D:1992 MOUNTING PADS, ELECTRICAL-ELECTRONIC COMPONENT, GENERAL SPECIFICATION FOR
MIL D 83531 : A (3) DELAY LINES, PASSIVE
MIL-E-17555 Revision H:1984 ELECTRONIC AND ELECTRICAL EQUIPMENT, ACCESSORIES, AND PROVISIONED ITEMS (REPAIR PARTS); PACKAGING OF
MIL-P-9024 Revision G:1972 PACKAGING, MATERIALS HANDLING AND TRANSPORTABILITY, SYSTEM AND SYSTEM SEGMENTS GENERAL SPECIFICATION FOR
MIL-STD-726 Revision H:1985 PACKAGING REQUIREMENTS CODE
MIL-H-87111 Revision A:1984 HEAT SINKS, SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
MIL S 19500 : J SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
DOD-D-24620-1 Base Document:1984 DETECTOR, PIN, FIBER OPTIC 820-910 NANOMETERS WAVELENGTH RANGE GLASS PIGTAILED TYPE
MIL-S-19500-202 Revision A:1962 SEMICONDUCTOR DEVICE, DIODE, SILICON, POWER RECTIFIERS, TYPES JAN 1N538M JAN 1N540M AND JAN 1N547M

PPP-C-1752 Revision D:1989 CUSHIONING MATERIAL, PACKAGING, POLYETHYLENE FOAM
MIL-B-117G:1993 BAG, SLEEVE AND TUBING
MIL-STD-129 Revision R:2014 Military Marking for Shipment and Storage
MIL-M-38527 Revision D:1992 MOUNTING PADS, ELECTRICAL-ELECTRONIC COMPONENT, GENERAL SPECIFICATION FOR
ASTM D 3953 : 2015 : REDLINE Standard Specification for Strapping, Flat Steel and Seals
MIL-H-87111 Revision A:1984 HEAT SINKS, SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
MIL B 81705 : C BARRIER MATERIALS, FLEXIBLE, ELECTROSTATIC FREE HEAT SEALABLE
MIL-STD-2073-1 Revision E:2008 STANDARD PRACTICE FOR MILITARY PACKAGING
MIL-STD-1686 Revision C:1995 ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)
MIL-STD-45662 Revision A:1988 CALIBRATION SYSTEMS REQUIREMENTS
DOD S 24622 : 1984 SOURCES, LED, FIBER OPTIC, GENERAL SPECIFICATION FOR (METRIC)
MIL-STD-750 Revision F:2011 TEST METHODS FOR SEMICONDUCTOR DEVICES
PPP-C-1797 Revision A:1982 CUSHIONING MATERIAL, RESILIENT, LOW DENSITY, UNICELLULAR POLYPROPYLENE FOAM
PPP-C-795 Revision D:1994 Cushioning Material, Closed Cell Flexible, Plastic Film
FED-STD-123 Revision H:2007 MARKING FOR SHIPMENT (CIVIL AGENCIES)
MIL-HDBK-263 Revision B:1994 ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL & ELECTRONIC PARTS, ASSEMBLIES & EQUIPMENT
MIL S 19500 : J SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
MIL-P-116 Revision J:1988 PRESERVATION, METHODS OF
DOD D 24620 : 1984 DETECTORS, PIN, FIBER OPTIC (METRIC)
MIL-STD-202 Revision H:2015 ELECTRONIC AND ELECTRICAL COMPONENT PARTS
PPP-C-1842 Revision B:1992 CUSHIONING MATERIAL, PLASTIC, OPEN CELL (FOR PACKAGING APPLICATIONS)

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