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MIL-STD-1605 Revision A:2009

MIL-STD-1605 Revision A:2009

Current

Current

The latest, up-to-date edition.

Procedures for Conducting a Shipboard Electromagnetic Interference (EMI) Survey (Surface Ship)

Available format(s)

PDF

Published date

10-08-2009

Publisher

US Military Specs/Standards/Handbooks

1. SCOPE
2. APPLICABLE DOCUMENTS
3. DEFINITIONS
4. GENERAL REQUIREMENTS
5. DETAILED REQUIREMENTS
6. NOTES

Specifies the procedures for demonstrating compliance with the intra and inter-system electromagnetic compatibility (EMC), hull-generated Intermodulation Interference (IMI), and electrical bonding requirements of MIL-STD-464 for naval surface ships.

This standard provides the procedures for demonstrating compliance with the intra and inter-system electromagnetic compatibility (EMC), hull-generated Intermodulation Interference (IMI), and electrical bonding requirements of MIL-STD-464 for naval surface ships. In addition, an EMI survey is required for new construction ships and ships receiving overhauls or other major repair work that changes the ships electromagnetic configuration.

DevelopmentNote
A NOTICE 1 - Notice of Validation. (08/2014)
DocumentType
Standard
Pages
18
PublisherName
US Military Specs/Standards/Handbooks
Status
Current

MIL-STD-464 Revision C:2010 ELECTROMAGNETIC ENVIRONMENTAL EFFECTS REQUIREMENTS FOR SYSTEMS
IEEE 1709-2010 IEEE Recommended Practice for 1 kV to 35 kV Medium-Voltage DC Power Systems on Ships
ANEP-45 : 0
IEEE/ANSI C63.14-2014 REDLINE American National Standard Dictionary of Electromagnetic Compatibility (EMC) including Electromagnetic Environmental Effects (E3)

MIL-STD-464 Revision C:2010 ELECTROMAGNETIC ENVIRONMENTAL EFFECTS REQUIREMENTS FOR SYSTEMS
MIL-STD-1310 Revision H:2009 SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY, ELECTROMAGNETIC PULSE (EMP) MITIGATION, AND SAFETY
IEEE/ANSI C63.14-2014 REDLINE American National Standard Dictionary of Electromagnetic Compatibility (EMC) including Electromagnetic Environmental Effects (E3)

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