MIL-STD-202-210 Base Document:2015
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NA
Status of Standard is Unknown
METHOD 210, RESISTANCE TO SOLDERING HEAT
Available format(s)
PDF
Language(s)
English
Publisher
FOREWORD
1. SCOPE
2. APPLICABLE DOCUMENTS
3. DEFINITIONS
4. GENERAL REQUIREMENTS
5. DETAILED REQUIREMENTS
6. NOTES
Establishes whether wire and other component parts can withstand the effects of the heat to which they will be subjected during the soldering process (solder iron, solder dip, solder wave, or solder reflow).
| Committee |
FSC 59GP
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
NA
|
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