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NASA GSFC-STD-6001:2021

Current

Current

The latest, up-to-date edition.

Area Array Package Assembly and Manufacturing Practices for Flight Hardware

Published date

07-30-2021

The purpose of this standard is to provide requirements and recommendations intended to facilitate production of defect-free area array solder joint interconnects to printed circuit boards intended for use in Flight, Flight Spare and Custom Mission Critical Support Hardware applications.

DocumentType
Standard
ProductNote
THIS STANDARD IS ALSO REFER TO IPC-6012S,IPC J-STD-001S,GSFC-STD-7000,GPR 8705.4
PublisherName
National Aeronautics and Space Administration
Status
Current

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