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NASA JSC 66491 : 2013

NASA JSC 66491 : 2013

Current

Current

The latest, up-to-date edition.

STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP)

Published date

01-01-2013

Publisher

National Aeronautics and Space Administration

1 GENERAL REQUIREMENTS
2 APPLICABLE DOCUMENTS
3 LEAD-FREE CONTROL PLAN (LFCP)
4 ACRONYMS AND ABBREVIATIONS AND GLOSSARY OF TERMS

Describes requirements for the control and mitigation of performance and reliability risks associated with the use of Lead-free Tin (Sn) and Lead-free Tin (Sn) technology in flight hardware, mission essential support equipment, and elements thereof.

DocumentType
Standard
PublisherName
National Aeronautics and Space Administration
Status
Current

IPC J STD 609 : A MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
MIL-D-3464 Revision E:1987 DESICCANTS, ACTIVATED, BAGGED, PACKAGING USE AND STATIC DEHUMIDIFICATION
NASA STD 8739.1 : 2016 WORKMANSHIP STANDARD FOR POLYMERIC APPLICATION ON ELECTRONIC ASSEMBLIES
NASA STD 8739.3 : 1998 SOLDERED ELECTRICAL CONNECTIONS
IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
NASA STD 8739.2 : 1999 WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY
MIL-STD-2073-1 Revision E:2008 STANDARD PRACTICE FOR MILITARY PACKAGING
IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
GEIA HB 0005-3 : 2008 REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
MIL-HDBK-338 Revision B:1998 ELECTRONIC RELIABILITY DESIGN HANDBOOK
GEIA STD 0005-2 : 2012 MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
IPC 1601 : 0 PRINTED BOARD HANDLING AND STORAGE GUIDELINES
NASA JSC 27301 : 2009 MATERIALS AND PROCESSES SELECTION, CONTROL, AND IMPLEMENTATION PLAN FOR JSC FLIGHT HARDWARE
GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
GEIA STD 0006 : 2008 REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
IPC QL 653 : A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
GEIA STD 0003 : 2006 LONG TERM STORAGE OF ELECTRONIC DEVICES
NASA STD 8709.20 : 2010

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