NEN 10249-2-19 : 1994 AMD 2 1995
Current
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The latest, up-to-date edition.
BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS
Published date
01-12-2013
Publisher
Provides requirements for properties of thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards.
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