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NEN EN IEC 60191-6-1 : 2002

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GULL-WING LEAD TERMINALS

Published date

01-12-2013

Includes the requirements for the design rule of terminal shape plastic packages with gull-wing leads; e.g., QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4.

DocumentType
Standard
PublisherName
Netherlands Standards
Status
Current

Standards Relationship
IEC 60191-6-1:2001 Identical
EN 60191-6-1:2001 Identical

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