NEN IEC 60191-5 : 1998
Current
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 5: RECOMMENDATIONS APPLYING TO INTEGRATED CIRCUIT PACKAGES USING TAPE AUTOMATED BONDING (TAB)
Published date
01-12-2013
Publisher
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions.
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