NEN NPR IEC/TR 60068-3-12 : 2014
Current
The latest, up-to-date edition.
ENVIRONMENTAL TESTING - PART 3-12: SUPPORTING DOCUMENTATION AND GUIDANCE - METHOD TO EVALUATE A POSSIBLE LEAD-FREE SOLDER REFLOW TEMPERATURE PROFILE
01-12-2013
Serves as a Technical Report and presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. It also covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components).
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