SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING

Published date

01-12-2013

Publisher

FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Test conditions
7 Precautions
8 Measurements
9 Failure criteria
10 Summary
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications

Determines the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors.

DevelopmentNote	Indice de classement: C96-022-34. PR NF EN 60749-34 March 2003. (03/2003) PR NF EN 60749-34 October 2010. (10/2010)
DocumentType	Standard
PublisherName	Association Francaise de Normalisation
Status	Current

Standards	Relationship
DIN EN 60749-34:2011-05	Identical
UNE-EN 60749-34:2011	Identical
EN 60749-34:2010	Identical
BS EN 60749-34:2010	Identical
IEC 60749-34:2010	Identical
I.S. EN 60749-34:2010	Identical

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NF EN 60749-34 : 2011

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING

Table of Contents

Abstract

General Product Information

International Equivalents

Category

Subcategory