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NF EN ISO 9455-17 : 2006

Current

Current

The latest, up-to-date edition.

SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES

Published date

01-12-2013

Avant-propos
1 Domaine d'application
2 Références normatives
3 Principe
4 Réactifs
5 Appareillage
6 Controle des coupons d'essai
7 Préparation des échantillons
8 Mode opératoire
9 Évaluation
10 Précision
11 Rapport d'essai
Annexe A (informative) Lignes directrices sur l'essai
         de RIS
Annexe B (informative) Essai au peigne et essai de
         migration électrochimique de résistance
         d'isolement de surface des résidus de
         flux - Rapport d'essai de qualification
Bibliographie

Describes a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders.

DevelopmentNote
Indice de classement: A81-365-17 PR NF EN ISO 9455-17 March 2006 (03/2006)
DocumentType
Standard
PublisherName
Association Francaise de Normalisation
Status
Current

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