OVE EN IEC 61190-1-3:2018
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Current
The latest, up-to-date edition.
Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017)
Available format(s)
Hardcopy
Language(s)
German - English
Published date
10-06-2018
Dieser Teil von IEC 61190 legt die Anforderungen und Prüfverfahren für Elektroniklote, für flussmittelgefüllte und massive Lote in Form von Barren, Stangen, Stäben und Bändern, Lotpulver und Lotpaste zum Löten von Elektronikprodukten sowie für ¿spezielle¿ Elektroniklote fest.
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