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PD IEC/TS 62878-2-1:2015

PD IEC/TS 62878-2-1:2015

Current

Current

The latest, up-to-date edition.

Device embedded substrate Guidelines. General description of technology

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

04-30-2015

Publisher

British Standards Institution

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Technology of device embedded substrate
5 Jisso mounting and interconnection
6 Naming of each section
Bibliography

Defines the basics of device embedding substrate.

This part of IEC 62878 describes the basics of device embedding substrate.

This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.

Committee
EPL/501
DocumentType
Standard
Pages
34
PublisherName
British Standards Institution
Status
Current

Standards Relationship
IEC TS 62878-2-1:2015 Identical

IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
IEC 62421:2007 Electronics assembly technology - Electronic modules
IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions

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Hardcopy - English
PDF - English
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