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PN EN 61190-1-2 : 2014

Current

Current

The latest, up-to-date edition.

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY

Published date

01-12-2013

Committee
TC 293
DocumentType
Standard
PublisherName
Polish Committee for Standardization
Status
Current

Standards Relationship
EN 61190-1-2:2014 Identical
IEC 61190-1-2:2014 Identical

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