• SAE ARP 5890 : 2011

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    GUIDELINES FOR PREPARING RELIABILITY ASSESSMENT PLANS FOR ELECTRONIC ENGINE CONTROLS

    Available format(s): 

    Superseded date:  11-29-2018

    Language(s): 

    Published date:  01-01-2011

    Publisher:  SAE International

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    Table of Contents - (Show below) - (Hide below)

    1. SCOPE
    2. REFERENCES
    3. RELIABILITY ASSESSMENT PLAN FOR ELECTRONIC
       ENGINE CONTROLS
    4. NOTES
    APPENDIX A - SIMILARITY ANALYSIS EXAMPLES
    APPENDIX B - DURABILITY ANALYSIS
    APPENDIX C - OTHER SOURCES OF INFORMATION

    Abstract - (Show below) - (Hide below)

    Specifies guidelines for a Reliability Assessment Plan (herein also called the Plan), in which Electronic Engine Control manufacturers document their controlled, repeatable processes for assessing reliability of their products.

    General Product Information - (Show below) - (Hide below)

    Committee E-36
    Document Type Standard
    Publisher SAE International
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC TS 62239-2:2017 Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan
    SAE ARP 6379 : 2016 PROCESSES FOR APPLICATION-SPECIFIC QUALIFICATION OF ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS AND SUB-ASSEMBLIES FOR USE IN AEROSPACE, DEFENSE, AND HIGH PERFORMANCE SYSTEMS
    EN 62308 : 2006 EQUIPMENT RELIABILITY - RELIABILITY ASSESSMENT METHODS
    MIL STD 11991 : A GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES
    BS EN 62308:2006 EQUIPMENT RELIABILITY - RELIABILITY ASSESSMENT METHODS
    EIA STD 4899 : 2017-05 REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
    EIA 933 : 2015 REQUIREMENTS FOR A COTS ASSEMBLY MANAGEMENT PLAN
    PD IEC/TS 62239-2:2017 Process management for avionics. Management plan Preparation and maintenance of an electronic COTS assembly management plan
    04/30101075 DC : DRAFT JUN 2004
    I.S. EN 62308:2006 EQUIPMENT RELIABILITY - RELIABILITY ASSESSMENT METHODS
    IEC 62308:2006 Equipment reliability - Reliability assessment methods

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC TS 62239-2:2017 Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan
    SAE ARP 6379 : 2016 PROCESSES FOR APPLICATION-SPECIFIC QUALIFICATION OF ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS AND SUB-ASSEMBLIES FOR USE IN AEROSPACE, DEFENSE, AND HIGH PERFORMANCE SYSTEMS
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    MIL-HDBK-87244 Base Document:1995 AVIONICS/ELECTRONICS INTEGRITY
    SAE ARP 4754 : 2010 GUIDELINES FOR DEVELOPMENT OF CIVIL AIRCRAFT AND SYSTEMS
    IEEE 1413 : 2010 FRAMEWORK FOR RELIABILITY PREDICTION OF HARDWARE
    IEC TS 62239-1:2015 Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
    SAE ARP 4761 : 1996 GUIDELINES AND METHODS FOR CONDUCTION THE SAFETY ASSESSMENT PROCESS ON CIVIL AIRBORNE SYSTEMS AND EQUIPMENT
    VITA 51.1 : 2008 (R2013) RELIABILITY PREDICTION MIL-HDBK-217 SUBSIDIARY SPECIFICATION
    GEIA STD 0005-2 : 2012 MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    SAE ARP 6338 : 2015 PROCESS FOR ASSESSMENT AND MITIGATION OF EARLY WEAROUT OF LIFE-LIMITED MICROCIRCUITS
    MIL-HDBK-217 Revision F:1991 RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT
    IEC 61709:2017 Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
    IEC 61709 : 3.0 ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    UTEC 80 811 : 2011 RELIABILITY METHODOLOGY FOR ELECTRONIC SYSTEMS - FIDES GUIDE 2009 ISSUE A
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