SEMI 3D6 : 2013
Current
Current
The latest, up-to-date edition.
GUIDE FOR CMP AND MICRO-BUMP PROCESSES FOR FRONTSIDE THROUGH SILICON VIA (TSA) INTEGRATION
Published date
10-09-2013
Gives a generic middle-end process flow to define acceptable TSV and CMP quality criteria as well as to develop methodology and measuring procedures for micro-bump.
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