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SEMI
SEMI P21 : 1992(R2003)

SEMI P21 : 1992(R2003)

Current

Current

The latest, up-to-date edition.

GUIDELINES FOR PRECISION AND ACCURACY EXPRESSION FOR MASK WRITING EQUIPMENT

Published date

01-12-2013

Publisher

Semiconductor Equipment & Materials Institute

Describes general requirements concerning accuracy and precision expression of mask writing equipment. Writing accuracy of the mask writing equipment is evaluated by measuring a written mask, and is affected greatly by process conditions to be carried out. Thus, the writing conditions are to be agreed upon by the user and the maker.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

Standards Relationship
SAC GB/T 16879 : 1997 Identical

BS IEC 62899-301-2:2017 Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
SEMI P10 : 2012 SPECIFICATION OF DATA STRUCTURES FOR PHOTOMASK ORDERS
SEMI P43 : 2004(R2011) PHOTOMASK QUALIFICATION TERMINOLOGY
14/30317965 DC : 0 BS EN 62903-2 ED.1 - PRINTED ELECTRONICS - EQUIPMENT - CONTACT PRINTING - RIGID MASTER - PART 2: MEASUREMENT METHOD OF PLATE MASTER PATTERN DIMENSION
IEC 62899-301-2:2017 Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension

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