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SN EN ISO 9455-17 : 2006

SN EN ISO 9455-17 : 2006

Current

Current

The latest, up-to-date edition.

SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES

Published date

01-12-2013

Publisher

Swiss Standards

Foreword
1 Scope
2 Normative references
3 Principle
4 Reagents
5 Apparatus
6 Inspection of test coupons
7 Sample preparation
8 Procedure
9 Assessment
10 Precision
11 Test report
Annex A (informative) SIR testing guidance
Annex B (informative) Surface insulation resistance comb
        test and electrochemical migration test of flux
        residues - Qualification test report
Bibliography

Describes a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders.

DocumentType
Standard
PublisherName
Swiss Standards
Status
Current

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