Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and symbols
   3.1 Terms and definitions
   3.2 Symbols and abbreviations
4 Principles
   4.1 General principles of the measurement
   4.2 Biaxial stress analysis
   4.3 Triaxial stress analysis
5 Specimen
   5.1 Material characteristics
        5.1.1 General
        5.1.2 Shape, dimensions and weight
        5.1.3 Specimen composition/homogeneity
        5.1.4 Grain size and diffracting domains
        5.1.5 Specimen X-ray transparency
        5.1.6 Coatings and thin layers
   5.2 Preparation of specimen
        5.2.1 Surface preparation
        5.2.2 Stress depth profiling
        5.2.3 Large specimen or complex geometry
6 Equipment
   6.1 General
   6.2 Choice of equipment
        6.2.1 General
        6.2.2 The [omega]-method
        6.2.3 The [chi]-method
        6.2.4 The modified [chi]-method
        6.2.5 Other geometries
   6.3 Choice of radiation
   6.4 Choice of the detector
   6.5 Performance of the equipment
        6.5.1 Alignment
        6.5.2 Performance of the goniometer
   6.6 Qualification and verification of the equipment
        6.6.1 General
        6.6.2 Qualification
        6.6.3 Verification of the performance of
               the qualified equipment
7 Experimental Method
   7.1 General
   7.2 Specimen positioning
   7.3 Diffraction conditions
   7.4 Data collection
8 Treatment of the data
   8.1 General
   8.2 Treatment of the diffraction data
        8.2.1 General
        8.2.2 Intensity corrections
        8.2.3 Determination of the diffraction
               line position
        8.2.4 Correction on the diffraction line
               position
   8.3 Stress calculation
        8.3.1 Calculation of strains and stresses
        8.3.2 Errors and uncertainties
   8.4 Critical assessment of the results
        8.4.1 General
        8.4.2 Visual inspection
        8.4.3 Quantitative inspection
9 Report
10 Experimental determination of XECs
   10.1 Introduction
   10.2 Loading device
   10.3 Specimen
   10.4 Loading device calibration and specimen
        accommodation
   10.5 Diffractometer measurements
   10.6 Calculation of XECs
11 Reference specimens
   11.1 Introduction
   11.2 Stress-free reference specimen
        11.2.1 General
        11.2.2 Preparation of the stress-free specimen
        11.2.3 Method of measurement
   11.3 Stress-reference specimen
        11.3.1 Laboratory qualified (LQ) stress-reference
               specimen
        11.3.2 Inter-laboratory qualified (ILQ)
               stress-reference specimen
12 Limiting cases
   12.1 Introduction
   12.2 Presence of a subsurface stress gradient
   12.3 Surface stress gradient
   12.4 Surface roughness
   12.5 Non-flat surfaces
   12.6 Effects of specimen microstructure
        12.6.1 Textured materials
        12.6.2 Multiphase materials
   12.7 Broad diffraction lines
Annex A (informative) - Schematic representation of
        the European XRPD Standardisation Project
Annex B (informative) - Sources of Residual Stress
      B.1 General
      B.2 Mechanical processes
      B.3 Thermal processes
      B.4 Chemical processes
Annex C (normative) - Determination of the stress
        state - General Procedure
      C.1 General
      C.2 Using the exact definition of the deformation
          C.2.1 General
          C.2.2 Determination of the stress tensor
                components
          C.2.3 Determination of [theta] and d[0]
      C.3 Using an approximation of the definition
          of the deformation
          C.3.1 General
          C.3.2 Determination of the stress tensor
                components
          C.3.3 Determination of [theta]0 and d[0]
Annex D (informative) - Recent developments
      D.1 Stress measurement using two-dimensional
          diffraction data
      D.2 Depth resolved evaluation of near surface
          residual stress - The Scattering Vector Method
      D.3 Accuracy improvement through the use of
          equilibrium conditions for determination
          of stress profile
Annex E (informative) - Details of treatment of the
        measured data
      E.1 Intensity correction on the scan
          E.1.1 General
          E.1.2 Divergence slit conversion
          E.1.3 Absorption correction
          E.1.4 Background correction
          E.1.5 Lorentz-polarisation correction
          E.1.6 K-Alpha2 stripping
      E.2 Diffraction line position determination
          E.2.1 Centre of Gravity methods
          E.2.2 Parabola Fit
          E.2.3 Profile Function Fit
          E.2.4 Middle of width at x% height method
          E.2.5 Cross-correlation method
      E.3 Correction on the diffraction line position
          E.3.1 General
          E.3.2 Remaining misalignments
          E.3.3 Transparency correction
Annex F (informative) - General description of
        acquisition methods
      F.1 Introduction
      F.2 Definitions
      F.3 Description of the various acquisition methods
          F.3.1 General method
          F.3.2 Omega (omega) method
          F.3.3 Chi (chi) method
          F.3.4 Combined tilt method (also called
                scattering vector method)
          F.3.5 Modified chi method
          F.3.6 Low incidence method
          F.3.7 Modified omega method
          F.3.8 Use of a 2D (area) detector
      F.4 Choice of [phi] and [psi] angles
      F.5 The stereographic projection
Annex G (informative) - Normal Stress Measurement
        Procedure" and "Dedicated Stress Measurement
        Procedure
      G.1 Introduction
      G.2 General
          G.2.1 Introduction
          G.2.2 Normal stress measurement procedure
                for a single specimen
          G.2.3 Dedicated Stress Measurement Procedure
                for very similar specimens
Bibliography