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WL 5.4111 : 1998

Current

Current

The latest, up-to-date edition.

AEROSPACE - STRUCTURAL ADHESIVE FILMS ON A MODIFIED EP BASIS - STANDARD CURING TEMPERATURE 175 DEGREES C, APPLICABLE FROM -55 DEGREES C TO 135 DEGREES C

Published date

01-12-2013

Das Dokument gilt für Klebfolien der Härtungsklasse 175 grad C, die zur Herstellung tragender Strukturen aus metallischen Fügeteilen bei Temperaturen von -55 grad C bis 135 grad C in der Luft- und Raumfahrt eingesetzt werden.

DevelopmentNote
Partially supersedes 1973 versions of WL 5.4101-1 & -2 (06/2002)
DocumentType
Standard
PublisherName
German Institute for Standardisation (Deutsches Institut für Normung)
Status
Current

DIN 65074:1999-03 AEROSPACE - ADHESIVE FILMS AND PRIMERS FOR STRUCTURAL ASSEMBLIES - TECHNICAL SPECIFICATION
DIN 29970:1998-09 AEROSPACE - HONEYCOMB CORES OF POLYAMIDE PAPER, PHENOLIC RESIN COATED - TECHNICAL SPECIFICATION

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