BS EN 61190-1-3 ED 3.0 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS

Available format(s)

Hardcopy , PDF

Language(s)

English

Publisher

British Standards Institution

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Classification
5 Requirements
6 Quality assurance provisions
7 Preparation for delivery - Preservation, packing
  and packaging
Annex A (informative) - Selection of various alloys
        and fluxes for use in electronic soldering - General
        information concerning IEC 61190-1-3
Annex B (normative) - Lead-free solder alloys
Annex C (informative) - Marking method of solder
        designation for mounted board, used in
        electronic equipment

BS EN 61190-1-3.

Committee	EPL/501
DocumentType	Draft
Pages	38
PublisherName	British Standards Institution
Status	NA

IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
ISO 9454-2:1998	Soft soldering fluxes Classification and requirements Part 2: Performance requirements
ISO 9454-1:2016	Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
IEC 61189-6:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
IEC 61189-5:2006	Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
ISO 9453:2014	Soft solder alloys Chemical compositions and forms